PCBA



  • Component placement:
    Chip 0201; 0.4mm fine pitch QFP; 0.4mm CSP; 0.5mm BGA; 0.75mm CSP/UBGA; 43*43mm BGA 660 I/O (14pcs/bd); BGA>2500 I/O; 15mm tall transformer; Press fit conn>700pin; 0.75mm LGA
  • Assembly:
    SMT(mixed, double sided); POP process, Auto insertion; Past-in hole; Wave/selective soldering; Conductive reflow; Board de-paneling/router and V-cutting
  • Inspection:
    LSM paste height measurement; On-line Automatic optical inspection; X-ray inspection (2.5DX)


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