Multilayer

• Number of layers
  4-12L
• Technology highlights
  heavy copper boards; power / Industrial control / Automotive boards
• Materials
  FR4 high , halogen free FR4
• Copper weights(finished)
  18um-210um
• Minimum track and gap
  0.075mm/0.075mm
• PCB thickness
  Min 0.40mm
• Maximum dimensions
  580mm * 680mm
• Surface finishes available
  HASL(SnPb), LF HASL(SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
• Minimum mechanical drill
  0.20mm

Rigid-Flex

• Number of layers
  4-10L
• Bending performance
  Based on the specific design, the bend performance can range from a basic 90° bend to fit to a full dynamic flex with 360°range of motion in the flex tail that will withstand continuous cycles throughout the product life
• Materials
  RA copper, THE copper, FR-4
• Copper weights(finished)
  12um, 18um, 36um
• Miniumu track and gap
  0.089mm/0.089mm (@ 18um copper weights)
• PCB thickness
  0.4mm to 1.5mm
• PCB thickness in flex section
  0.08mm to 0.2mm
• Maximum dimensions
  457mm to 610mm
• Surface finishes available
  ENIG, ENEPIG
• Minimum mechanical drill
  0.21mm drilled(0.15mm finished)

Flexible

• Number of layers
  1-8L
• Materials
  Polyimide, Polyester0.1mm-3.0mm
• Copper weights(finished)
  2um - 70um
• Miniumu track and gap
  0.03mm/0.03mm
• PCB thickness
  Min. 0.05mm
• Metal core thickness
  0.05mm – 0.5mm
• Maximum dimensions
  Max. width 500mm (NO limitation on length)
• Surface finished available
  OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers
• Minimum mechanical drill
  0.10mm
• Minimum leaser drill
  0.025mm

Double sided

• Number of layers
  2L
• Materials
  FR4 , Halogen free FR4
• copper weights(finished)
  18um-120um
• Miniumu track and gap
  0.075mm/0.075mm
• PCB thickness
  Min 0.40mm
• Maximum dimensions
  510mm*680mm
• Surface finished available
  
  HASL(SnPb), LF HASL(SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
• Minimum mechanical drill
  0.20mm

INSULATED  METAL SUBSTRATE BOARD

• Number of layers
  1-2L
• Materials
  Aluminium & copper plates.
• Dielectric thickness
  0.10mm，0.15mm
• Thermal conductivity
  12 W/m/K
• Profile method
  Punching, Liquid cooled routing
• Copper weights(finished)
  18um-105um
• Miniumu track and gap
  0.10mm/0.10mm
• Metal core thickness
  Min 0.40mm
• Maximum dimensions
  550mm*700mm
• Surface finished available
  HASL, LF-HASL, OSP
• Minimum mechanical drill
  0.50mm

INSULATED  CERAMIC SUBSTRATE BOARD

• Number of layers
  1-2L
• Technology highlights
  High thermal conductivity, High insulation, High dielectric constant
• Materials
  Alumina ceramics, Aluminium Nitride Ceramic
• Coper weights(finished)
  18um-300um
• Minimum track and gap
  0.1mm/0.1mm
• PCB thickness
  0.25 - 2mm
• Maximum dimensions
  130mm * 180mm
• Surface finishes available
  OSP, ENIG, ENEPIG, Immersion Tin, Electrolytic gold
• Minimum mechanical drill
  0.30mm