PCB

Demo Factory - Multilayer



Demo Factory - HDI


Demo Factory - FPC



Products

Multilayer

  • Number of layers
    4-12L
  • Technology highlights
    heavy copper boards; power / Industrial control / Automotive boards
  • Materials
    FR4 high , halogen free FR4
  • Copper weights(finished)
    18um-210um
  • Minimum track and gap
    0.075mm/0.075mm
  • PCB thickness
    Min 0.40mm
  • Maximum dimensions
    580mm * 680mm
  • Surface finishes available
    HASL(SnPb), LF HASL(SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
  • Minimum mechanical drill
    0.20mm




Rigid-Flex

  • Number of layers
    4-10L
  • Bending performance
    Based on the specific design, the bend performance can range from a basic 90° bend to fit to a full dynamic flex with 360°range of motion in the flex tail that will withstand continuous cycles throughout the product life
  • Materials
    RA copper, THE copper, FR-4
  • Copper weights(finished)
    12um, 18um, 36um
  • Miniumu track and gap
    0.089mm/0.089mm (@ 18um copper weights)
  • PCB thickness
    0.4mm to 1.5mm
  • PCB thickness in flex section
    0.08mm to 0.2mm
  • Maximum dimensions
    457mm to 610mm
  • Surface finishes available
    ENIG, ENEPIG
  • Minimum mechanical drill
    0.21mm drilled(0.15mm finished)




Flexible

  • Number of layers
    1-8L
  • Materials
    Polyimide, Polyester0.1mm-3.0mm
  • Copper weights(finished)
    2um - 70um
  • Miniumu track and gap
    0.03mm/0.03mm
  • PCB thickness
    Min. 0.05mm
  • Metal core thickness
    0.05mm – 0.5mm
  • Maximum dimensions
    Max. width 500mm (NO limitation on length)
  • Surface finished available
    OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers
  • Minimum mechanical drill
    0.10mm
  • Minimum leaser drill
    0.025mm




Double sided

  • Number of layers
    2L
  • Materials
    FR4 , Halogen free FR4
  • copper weights(finished)
    18um-120um
  • Miniumu track and gap
    0.075mm/0.075mm
  • PCB thickness
    Min 0.40mm
  • Maximum dimensions
    510mm*680mm
  • Surface finished available

    HASL(SnPb), LF HASL(SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
  • Minimum mechanical drill
    0.20mm







INSULATED  METAL SUBSTRATE BOARD

  • Number of layers
    1-2L
  • Materials
    Aluminium & copper plates.
  • Dielectric thickness
    0.10mm,0.15mm
  • Thermal conductivity
    12 W/m/K
  • Profile method
    Punching, Liquid cooled routing
  • Copper weights(finished)
    18um-105um
  • Miniumu track and gap
    0.10mm/0.10mm
  • Metal core thickness
    Min 0.40mm
  • Maximum dimensions
    550mm*700mm
  • Surface finished available
    HASL, LF-HASL, OSP
  • Minimum mechanical drill
    0.50mm




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INSULATED  CERAMIC SUBSTRATE BOARD

  • Number of layers
    1-2L
  • Technology highlights
    High thermal conductivity, High insulation, High dielectric constant
  • Materials
    Alumina ceramics, Aluminium Nitride Ceramic
  • Coper weights(finished)
    18um-300um
  • Minimum track and gap
    0.1mm/0.1mm
  • PCB thickness
    0.25 - 2mm
  • Maximum dimensions
    130mm * 180mm
  • Surface finishes available
    OSP, ENIG, ENEPIG, Immersion Tin, Electrolytic gold
  • Minimum mechanical drill
    0.30mm

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